ULIS launches Micro80 Gen2TM thermal sensor aimed at large-volume applications
- Date: 9th September 2016
- Company: ULIS
Improved 80x80 sensor optimized for easy integration into assembly processes for mass production
ULIS will display Micro80 Gen2TM, first thermal sensor designed with a Unique Wafer Level Packaging, during CIOE in Shenzhen, China, September 6 – 9, 2016
Veurey-Voroize, near Grenoble, France, September 6, 2016 - ULIS, a manufacturer of innovative thermal sensors for the surveillance, thermography, firefighting, outdoor leisure and automotive markets, announces today the availability of Micro80 Gen2, an advanced functionality thermal sensor.
The fully digital Micro80 Gen2 not only supports standardized interfaces (i.e. I2C and HSync/VSync clocking) it also contains a series of improved characteristics, which make it ideal for large-volume applications and for easy integration into assembly processes.
It features novel packaging solutions by being the first Ball Grid Array (BGA) infrared sensor box packaged in a JEDEC tray. It is designed using a Unique Wafer Level Packaging (UWLP) with vacuum technology; this allows it to support optical fields of up to 120°. It is the first infrared sensor with a unique plastic lens holder, eliminating the need for the user to develop its own, thus saving time and lowering costs.
The new Micro80 Gen2 consumes less than 55mW. This further extends the battery life and the operating temperature range (-40°C to +85°C), while being more compact and lighter than earlier models. It supports a broad spectrum of frame rates (from 1Hz to 50 Hz) and allows vision up to 150 meters.
“These new and improved features of the Micro80 Gen2 address the needs of large-volume production processes. This means that it is not only ideal for the small-resolution thermography and short-distance surveillance markets, but can also open up new industries for ULIS,” said Cyrille Trouilleau, product manager at ULIS. “The introduction of these novel characteristics is the first step towards the widespread use of thermal sensors in smart building management systems.”
ULIS’ new Micro80 Gen2 multifunctional thermal sensor offers reliability thanks to the 80x80 pixel ratio. It can distinguish humans from animals or robots in all-weather and lighting conditions, 24/7 – without compromising privacy. This makes it ideal for occupancy detection in connected buildings, amongst other potential applications.
ULIS will exhibit Micro80 Gen2 at one of the world’s largest optoelectronics events: CIOE in Shenzhen, China, September 6 – 9 at Booth #1D03.
At the Executive Imaging Infrared Forum, part of CIOE, Cyrille Trouilleau, product manager at ULIS, will hold a presentation about the use of ULIS’ products in smart buildings. Further information about the presentation can be found at: http://www.i-micronews.com/ir-imaging-forum-agenda.html